Taiwan and Lithuania have taken another important step forward in their technology partnership with the signing of a five-party Memorandum of Understanding (MOU) on laser technology cooperation during SEMICON Taiwan 2026 on September 4.
The MOU was signed by the Industrial Technology Research Institute (ITRI), Taiwan Electronic Equipment Industry Association (TEEIA), Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA), Center for Physical Sciences and Technology (FTMC), and Laser Association of Lithuania (LLA), witnessed by Taiwan’s Foreign Minister Lin Chia-lung and Lithuanian Representative Karolis Pilipauskas.
Building on the Ultrafast Laser Technology Research and Innovation Center (ULTRI) established in 2023, the new agreement further links Lithuania’s cutting-edge laser technologies with Taiwan’s advanced semiconductor capabilities, extending bilateral cooperation into advanced semiconductor packaging and manufacturing.
Under the new phase of cooperation, €5.6 million will be invested over the next two years to upgrade high-end laser equipment and support joint research and development, with a focus on applying advanced laser technologies to heterogeneous integration and advanced semiconductor packaging. Next-generation laser sources will also be introduced at ULTRI to support new applications in advanced semiconductor manufacturing.
According to ITRI’s estimation, the cooperation is expected to help Taiwanese equipment manufacturers sell approximately 15 integrated systems within two years, with cumulative production value potentially exceeding NT$500 million (approximately €13.6 million) over five years. It will also create new opportunities for Lithuanian laser technologies and components to connect with Taiwan’s semiconductor ecosystem.
This latest initiative demonstrates Taiwan’s continued commitment to bringing together the cutting-edge technologies of Taiwan and Lithuania, transforming their complementary strengths into innovation, mutual benefits, and a more resilient supply chain.
