The Taipei Economic and Cultural Office in Myanmar is pleased to announce that TaiwanICDF is accepting applications for the 2026 TaiwanICDF Higher Education Scholarship.
The International Higher Education Scholarship Program is a key initiative of the TaiwanICDF that offers full scholarships to outstanding students from partner countries. This program enables these students to pursue higher education in Taiwan in collaboration with local universities.The primary goal of the program is to assist partner countries in their social and economic development by training skilled professionals. Additionally, it supports the internationalization of Taiwanese universities and provides Taiwanese students with a broader global perspective.
Applicants must complete the scholarship program application online via the official portal: https://web.icdf.org.tw/ICDF_TSP/WelcomeStart.aspx. Applicants must complete online application before March 15, 2026.
Application Documents
After completing the online application, applicants must submit the following documents to our office.
- A TaiwanICDF International Higher Education Scholarship Application Form
- A photocopy of the applicant’s passport or other documentary evidence of nationality
- A photocopy of their highest academic award and of the associated academic transcripts (authenticated by Ministry of Foreign Affairs, Myanmar)
- A photocopy of a language proficiency certificate (TOEFL/IELTS)
- Two reference letters – from a principal, a college or university president, professors, and/or supervisors – personally signed, and placed in sealed envelopes.
Submission Information
Application and supporting documents should be sent to the following address, postmarked no later than March 20, 2026.
Application for the TaiwanICDF Scholarship
Taipei Economic and Cultural Office in Myanmar
No. 97/101(A), Dhammazedi Road, Kamayut Township, Yangon, Myanmar
Inquiries: For further questions, please contact us by email at: mmr@mofa.gov.tw or visit http://www.icdf.org.tw/wSite/np?ctNode=31561&mp=2.
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